BERGQUIST UNVEILS A REVOLUTIONARY NEW THERMAL INTERFACE COMPOUND THAT KEEPS PACE WITH HIGHER-POWERED COMPUTER PROCESSORS

CONTACT: Rick Samuelson
(888) 942-8552 MINNEAPOLIS, MN – The Bergquist Company, known worldwide for its innovations in thermal interface solutions, has announced its new TIC-7500™ Thermal Interface Compound. Bergquist engineers developed TIC-7500 expressly to meet the critical demand for a next-generation thermal interface material that provides the low thermal resistance mandatory for the increasingly faster and hotter microprocessors.Testing shows that Bergquist's patent-pending TIC-7500 compound is just the solution leading computer companies need for the next generations of workstations, servers and super computers. Real-time comparative tests using Bergquist's new thermal interface compound, TIC-7500, showed that it will deliver half the thermal resistance as the best silicone grease on 950 MHz and 1 GHzchips! TIC-7500 achieved this feat with an unprecedented thermal conductivity of 7.5 W/m-K.With TIC-7500, computer makers can use the fastest chips without the penalty of adding evaporators, bigger fans or channeled air flow for extra cooling. Standard heat sink and fan combinations can continue to be used. The exact compound used in TIC-7500 is yet to be disclosed, but it has negligible electrical conductivity and has a very precise consistency that won't drip, yet easily conforms to the chip and heat sink surfaces. TIC-7500 can even be applied using existing grease application equipment in most cases.The Bergquist Company is an industry leader and the largest supplier of thermal interface materials for computers. For additional information on TIC-7500 and to receive a free test sample, contact The Bergquist Company at 1-888-942-8552 or visit their web site, www.bergquistcompany.com.





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